Magnetron Sputtering Cathodes SMC series
Magnetron Sputtering Cathodes SMC series
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Product Overview
Magnetron Sputtering Cathodes——SMC series, designed and manufactured by Scion Plasma, is suitable for R&D applications. The Magnetron Sputtering Cathodes can be used for 2”, 3”, and 4” targets of 1/8” to 1/4” thickness. SMC Series designs are optimized using the Scion plasma’s proprietary plasma simulation software ASTRA, enabling a unique low-voltage and high-current discharge mode, which results in increased deposition rates and reduced damage to delicate films and substrates. The SMC series magnetrons sputtering are suitable for sputtering all types of non-magnetic materials.
When the SMC Series used with Scion Plasma's ion sources (click here to know more about Scion Plasma's Ion source), they can enable a new soft-sputtering mode that features low sputtering voltage and high current, which not only leads to ~30% increase in the deposition rates but also greatly reduces damage to delicate film surfaces.
Product Features
- Wide range of discharge pressures from 0.5 to 50 mTorr owing to an efficient electron confinement. This feature provides the flexibility for process development.
- Proprietary spring-loaded target clamp ensuring tight target-cathode contact while accommodating target thermal expansion. This design reduces the risk of target cracking that customers often experience in conventional designs.
- Simple and easy target change from the front side. Cooling water is not exposed to vacuum chamber during target change.
- Magnets not exposed to vacuum and cooling water. This feature results in reliable and stable operation.
- Standard vacuum feedthroughs, N-type power connector, and ¼” push-to-connect water connectors.
- Flex head adjustable from 0 to 75 degrees.
Options
Scion Plasma offers a variety of sputtering products.
- Magnetrons for sputtering magnetic materials
- Unbalanced magnetrons sputtering
- Linear magnetron sputtering of >10” in length with a strong magnetic field and high target utilization rates
- Compact rotary magnetron sputtering cathodes
- Metal, insulator, and semiconductor sputtering targets
Specifications (Datasheet Download)
|
Model (Target Size) |
Magnetron Sputtering Cathodes SMC-2 (2”), SMC-3 (3”), SMC-4 (4”) |
|
Target Thickness |
1/8”, 1/4” |
|
Target Installation |
Clamp |
|
Vacuum |
HV and UHV |
|
Typical Operation Pressure |
1 – 10 mTorr |
|
Process Gases |
All common gases (Ar, O2, N2, CH4, H2) |
|
Sputtering Power Supply |
DC, pDC, RF, DC+RF |
|
Distance from Substrate |
2” – 4” |
|
Internal Mounting |
3/4” SS tubing (any length) with baseplate feedthrough adapter, CF flange adapter, and KF flange adapter |
|
External Mounting |
O-ring flange per customer specification |
|
Cooling Water |
0.2 – 0.4 gpm, <40 PSI, 1/4” push-to-connect |
|
Electrical Connection |
N-type connector |
|
Processed Materials |
Metals, semiconductors, dielectrics |
|
Warranty |
1-year product warranty |
Dimensions
Image showing the effect of using a Magnetron Sputtering Cathodes and ion source together.
Ion energy distribution, showing narrow
ion energy peaks tunable over a wide range.
X-ray diffraction patterns of piezoelectric AlN thin films deposited at room temperature using the broad beam ion source enhanced sputtering.
SEM images and optical transmittance of ultra-thin silver films deposited with and without using the broad beam ion source. The ion source treatment results in much thinner and continuous films.
Resistivity of ultra-thin silver films prepared with and without the ion beam. The optical images show 100-grid adhesion test on silver films prepared with (a) and without (b) the ion beam treatment.
Free Download
Magnetron Sputtering Cathodes SMC Series datasheet
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