SPR-100 ion source

Product Overview

 

Scion Plasma’s patented SPR-100 broad beam ion source is a revolutionary plasma source that can be used to enhance magnetron sputtering, PECVD, and surface treatment. The ion source is developed based on a comprehensive plasma simulation using the company’s proprietary software ASTRA. The ion source can generate a broad single ion beam of ~80 mm diameter. The ion energy and ion current can be independently controlled from 10 to 200 eV and 50 to 1,000 mA, respectively. The ion energy distribution features a single narrow peak, which enables optimum energy transfer to the surface atoms as they are deposited. This unique characteristic allows the growth of thin films with randomly oriented and preferentially oriented polycrystalline microstructure at room temperature, which is particularly attractive for coating heat-sensitive materials. When combined with a magnetron, the ion source enables a new soft-sputtering mode that features low sputtering voltage and high current, which not only leads to ~30% increase in the deposition rates but also greatly reduces damage to delicate film surfaces. When the broad beam plasma source is used for PECVD, it results in highly efficient source gas dissociation and subsequently high deposition rates, which are highly desirable for barrier coatings and optical coatings. The broad beam plasma source is also ideal for surface treatments, which often require low ion energy and high ion flux. The ion source can operate stably over an extended period with little maintenance.

 

 

Product Features

• A broad single ion beam directed to the sample surface
• Narrow ion energy distribution
• Independently tunable ion energy and ion current over a wide range
• Fully compatible with magnetron sputtering. No need to flow gas through the source can use gases in the chamber
• Stable operation over a long period
• Easy maintenance
• Scalable to any desired length for large-scale mass production
• Standard vacuum feedthroughs, N-type power connector, and ¼” push-to-connect water connectors.
• Flex head adjustable from 0 to 75 degrees.  

 

Options

 

Scion Plasma offers a variety of sputtering products.

·        Magnetrons for sputtering magnetic materials

·        Unbalanced sputtering magnetrons

·        Linear sputtering magnetrons of >10” in length with a strong magnetic field and high target utilization rates

·        Compact rotary sputtering magnetrons

·        Metal, insulator, and semiconductor sputtering targets 

 

Specifications

 

Model	SPR-100
Vacuum	HV and UHV
Typical Operation Pressure	1 – 2.000 mTorr
Process Gases	All common gases (Ar, O2, N2, CH4, H2)
Discharge DC voltage	0 – 200 VDC
Discharge DC current	0 – 1,000 mA
DC+RF Power	0 – 200 W (DC), 10 – 100 W (RF)
Distance from Substrate	1” – 5”
Internal Mounting	3/4” and 1” SS tubing (any length) with baseplate feedthrough adapter, CF flange adapter, and KF flange adapter
External Mounting	O-ring flange per customer specification
Cooling Water	0.2 – 0.4 gpm, <40 PSI, 1/4” push-to-connect
Electrical Connection	N-type connector
Process (Recommended)	Ion beam enhanced magnetron sputtering, PECVD, etching
Processed Materials	Metals, semiconductors, dielectrics
Warranty	1-year product warranty

 

Dimensions