SPR-100 Ion Source

Product Overview

Scion Plasma’s patented SPR-100 broad-beam ion source is a next-generation plasma tool designed to enhance magnetron sputtering, PECVD, and surface-treatment processes. Developed through comprehensive plasma simulations using the company’s proprietary ASTRA software, the SPR-100 produces a uniform single ion beam approximately 80 mm in diameter. The ion source offers independent control of ion energy (10–150 eV) and ion current (10–800 mA). Its narrow, single-peaked ion-energy distribution enables highly efficient energy transfer to surface atoms during deposition. This capability enables the growth of dense polycrystalline films at room temperature, making the SPR-100 especially valuable for coating heat-sensitive substrates. When paired with a magnetron, the SPR-100 results in a new soft-sputtering mode characterized by low sputtering voltage and high current. This mode delivers substantially higher deposition rates while minimizing damage to delicate surfaces. In PECVD applications, the broad-beam plasma provides highly efficient precursor dissociation, resulting in high deposition rates, dense films, and smooth surfaces well suited for barrier and optical coatings. The SPR-100 is also ideal for surface-treatment applications that commonly require low ion energy combined with high ion flux. Designed for long-term stability, the ion source delivers extended operation with minimal maintenance.

 

Product Features

• A broad single ion beam directed to the sample surface
• Narrow ion energy distribution
• Independently tunable ion energy and ion current over a wide range
• Fully compatible with magnetron sputtering. The ion source does not require a dedicated gas flow, as it operates using the process gases already present in the chamber. For specific applications—such as MetaMode deposition of oxide thin films—a dedicated gas feed to the ion source can be introduced to further enhance film oxidation.
• Stable operation over a long period
• Easy maintenance
• Scalable to any desired length for large-scale mass production
• Standard vacuum feedthroughs, N-type power connector, and ¼” push-to-connect water connectors
• Flex head adjustable from 0 to 75 degrees
  

Accessories Required to Operate the Ion Source

1. RF Power Supply

• Frequency: 13.56 MHz
• Output Power: 300–1000 W

Customer may source any compatible RF supply. You may also choose our SP-RF-01-1000W RF Power Supply. 

2. DC Power Supply

• Output Voltage: 0-150 V positive
• Output Current: 0-1 A

Customer may source any compatible DC supply. You may also choose our SP-DC-01-200V-5A DC Power Supply. 

3. RF–DC Filter Box

• RF Frequency: 13.56 MHz
• Breakdown Voltage: 1000 Vpp
• RF Power: 300 W
• DC Current: 1 A

Customer may source any compatible RF-DC Filter. You may also choose our SP-FT-01-1000 RF-DC Filter Box.

4. Installation Flange Adapters

Customers can select one of our standard flange adapters listed below to match the port on their vacuum system.   

CF flange adapters:

o   2-3/4” CF flange adapter: CFA0111304LSS

o   4” CF flange adapter: CFA0112304LSS

o   6” CF flange adapter: CFA0113304LSS

KF flange adapters:

o   KF25 flange adapter: KFA0121304LSS

o   KF40 flange adapter: KFA0122304LSS

o   KF50 flange adapter: KFA0123304LSS

 

Specifications

 

Model	SPR-100
Vacuum	HV and UHV
Typical Operation Pressure	1 – 200 mTorr
Process Gases	All common gases (Ar, O2, N2, CH4, H2)
Discharge DC voltage	0 – 150 VDC
Discharge DC current	0 – 800 mA
DC+RF Power	0 – 100 W (DC), 10 – 100 W (RF)
Distance from Substrate	1” – 5”
Internal Mounting	3/4” and 1” SS tubing (any length) with baseplate feedthrough adapter, CF flange adapter, and KF flange adapter
External Mounting	O-ring flange per customer specification
Cooling Water	0.2 – 0.4 gpm, <40 PSI, 1/4” push-to-connect
Electrical Connection	N-type connector
Process (Recommended)	Ion beam enhanced magnetron sputtering, PECVD, etching
Processed Materials	Metals, semiconductors, dielectrics
Warranty	1-year product warranty

 

Dimensions